Alliance Memory, Inc.
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AS4C128M16D2-25BCN
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AS4C128M16D2-25BCN

Product Overview

Category

AS4C128M16D2-25BCN belongs to the category of semiconductor memory products.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and other digital systems.

Characteristics

  • High-speed performance
  • Large storage capacity
  • Low power consumption
  • Reliable data retention
  • Compact package size

Package

AS4C128M16D2-25BCN is available in a small form factor package, making it suitable for space-constrained applications.

Essence

The essence of AS4C128M16D2-25BCN lies in its ability to store and retrieve digital information quickly and reliably.

Packaging/Quantity

AS4C128M16D2-25BCN is typically packaged in trays or reels, with each package containing a specific quantity of memory chips.

Specifications

  • Part Number: AS4C128M16D2-25BCN
  • Memory Type: Synchronous DRAM (SDRAM)
  • Organization: 128 Megabit x 16
  • Operating Voltage: 2.5V
  • Speed Grade: -25
  • Package Type: BGA (Ball Grid Array)
  • Pin Count: 60

Detailed Pin Configuration

The pin configuration of AS4C128M16D2-25BCN is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. VSS
  19. NC
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. A16
  37. A17
  38. A18
  39. A19
  40. A20
  41. BA0
  42. BA1
  43. RAS#
  44. CAS#
  45. WE#
  46. CKE
  47. CS#
  48. DM0
  49. DM1
  50. VDDQ
  51. VSSQ
  52. VREF
  53. ODT
  54. DQS0
  55. DQS1
  56. DQS2
  57. DQS3
  58. VSS
  59. VDD
  60. NC

Functional Features

  • High-speed data transfer
  • Burst mode operation
  • Auto-refresh and self-refresh modes
  • On-die termination (ODT) for improved signal integrity
  • Programmable CAS latency

Advantages and Disadvantages

Advantages

  • Fast data access and retrieval
  • Large storage capacity
  • Low power consumption
  • Compact package size
  • Reliable data retention

Disadvantages

  • Relatively higher cost compared to other memory technologies
  • Sensitive to electrostatic discharge (ESD)
  • Limited lifespan due to finite write/erase cycles

Working Principles

AS4C128M16D2-25BCN operates based on the principles of synchronous dynamic random-access memory (SDRAM). It stores digital data in a matrix of capacitors, with each capacitor representing a single bit of information. The memory cells are organized into rows and columns, allowing for efficient read and write operations.

Detailed Application Field Plans

AS4C128M16D2-25BCN finds applications in various electronic devices and systems, including: - Personal computers - Laptops and notebooks - Servers - Mobile phones and tablets - Gaming consoles - Networking equipment - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

Some alternative models to AS4C128M16D2-25BCN include: - AS4C256M16D2-25BCN - AS4C512M16D2-25BCN - AS4C1024M16D2-25BCN - AS4C2048M16D2-25BCN

These alternative models offer similar functionality and characteristics but may differ in terms of storage capacity and package size.

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Luettele 10 yleistä kysymystä ja vastausta, jotka liittyvät AS4C128M16D2-25BCN :n soveltamiseen teknisissä ratkaisuissa

Sure! Here are 10 common questions and answers related to the application of AS4C128M16D2-25BCN in technical solutions:

  1. Question: What is AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN is a specific model of synchronous dynamic random-access memory (SDRAM) chip.

  2. Question: What is the capacity of AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN has a capacity of 128 megabits (16 megabytes).

  3. Question: What is the speed rating of AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN has a speed rating of 25 nanoseconds (ns).

  4. Question: What are some typical applications for AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN is commonly used in various technical solutions such as computer systems, networking devices, industrial equipment, and telecommunications infrastructure.

  5. Question: What is the voltage requirement for AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN operates at a voltage of 2.5 volts (V).

  6. Question: Does AS4C128M16D2-25BCN support error correction?
    - Answer: No, AS4C128M16D2-25BCN does not have built-in error correction capabilities.

  7. Question: Can AS4C128M16D2-25BCN be used in both commercial and industrial applications?
    - Answer: Yes, AS4C128M16D2-25BCN is suitable for both commercial and industrial applications.

  8. Question: What is the package type of AS4C128M16D2-25BCN?
    - Answer: AS4C128M16D2-25BCN comes in a 60-ball FBGA (Fine-Pitch Ball Grid Array) package.

  9. Question: Is AS4C128M16D2-25BCN compatible with other SDRAM chips?
    - Answer: AS4C128M16D2-25BCN follows industry-standard specifications and can be used alongside compatible SDRAM chips.

  10. Question: Can AS4C128M16D2-25BCN be easily integrated into existing systems?
    - Answer: Yes, AS4C128M16D2-25BCN is designed to be easily integrated into various system architectures and can be used as a drop-in replacement for similar SDRAM chips.

Please note that these answers are general and may vary depending on specific technical requirements and application scenarios.