AS4C128M16D3L-12BIN

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-speed performance
  • Low power consumption
  • Large storage capacity
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

• Part Number: AS4C128M16D3L-12BIN
• Organization: 128 Megabit x 16
• Speed: 12ns
• Voltage: 1.5V
• Interface: Double Data Rate 3 (DDR3)
• Operating Temperature: -40°C to +85°C

Detailed Pin Configuration

The AS4C128M16D3L-12BIN has a total of 60 pins arranged as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3-10 | DQ0-DQ7 | Data input/output pins | | 11 | DQS | Data strobe signal | | 12 | DM | Data mask signal | | 13-20 | DQ8-DQ15 | Data input/output pins | | ... | ... | ... | | 59 | BA1 | Bank address bit 1 | | 60 | BA0 | Bank address bit 0 |

Functional Features

• High-speed operation allows for fast data access and transfer.
• Low power consumption helps conserve energy.
• Large storage capacity enables the storage of a significant amount of data.
• DDR3 interface provides improved data transfer rates compared to previous generations.

Advantages

• High-speed performance allows for efficient data processing.
• Low power consumption helps extend battery life in portable devices.
• Large storage capacity meets the demands of modern applications.
• DDR3 interface ensures compatibility with a wide range of systems.

Disadvantages

• Higher cost compared to older memory technologies.
• Limited scalability beyond the specified storage capacity.
• Sensitive to electrical noise and requires proper grounding and shielding.

Working Principles

The AS4C128M16D3L-12BIN is based on dynamic random access memory (DRAM) technology. It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. The DDR3 interface allows for high-speed data transfer by utilizing both the rising and falling edges of the clock signal.

Detailed Application Field Plans

The AS4C128M16D3L-12BIN is commonly used in various electronic devices and systems, including: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics

Detailed and Complete Alternative Models

• AS4C128M16D3L-12BCN
• AS4C128M16D3L-12BCN-T
• AS4C128M16D3L-12BCN-TR
• AS4C128M16D3L-12BCN-TD
• AS4C128M16D3L-12BCN-TDR

These alternative models offer similar specifications and functionality as the AS4C128M16D3L-12BIN, providing options for different sourcing and availability requirements.

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