AS4C512M8D3LB-12BINTR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-density storage
  • Low power consumption
  • Fast data transfer rate
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

• Part Number: AS4C512M8D3LB-12BINTR
• Memory Type: DDR3 SDRAM
• Capacity: 512 Megabits (64 Megabytes)
• Organization: 512M x 8 bits
• Speed Grade: 12 (DDR3-1600)
• Operating Voltage: 1.5V
• Interface: Parallel
• Clock Frequency: 800 MHz
• Refresh Mode: Auto-refresh and self-refresh
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C512M8D3LB-12BINTR has a total of 60 pins arranged in a specific configuration. Please refer to the datasheet for the detailed pinout diagram.

Functional Features

• High-speed data transfer: The DDR3 SDRAM technology allows for fast and efficient data transfer between the memory module and the system.
• Large storage capacity: With a capacity of 512 Megabits, the AS4C512M8D3LB-12BINTR provides ample space for storing data.
• Low power consumption: The memory module is designed to operate at low voltage, reducing power consumption and heat generation.
• Auto-refresh and self-refresh modes: These features ensure data integrity and reliability by automatically refreshing the stored information.

Advantages and Disadvantages

Advantages: - High-density storage allows for more data to be stored in a compact form. - Fast data transfer rate improves system performance. - Low power consumption contributes to energy efficiency.

Disadvantages: - DDR3 technology is older compared to newer generations like DDR4 or DDR5. - Limited capacity compared to higher-capacity memory modules available in the market.

Working Principles

The AS4C512M8D3LB-12BINTR operates based on the principles of dynamic random access memory (DRAM). It stores data in capacitors within the memory cells, which need to be periodically refreshed to maintain the stored information. The memory controller sends commands and addresses to access specific data stored in the memory module.

Detailed Application Field Plans

The AS4C512M8D3LB-12BINTR is commonly used in various electronic devices and systems that require high-speed and reliable memory storage. Some application fields include: - Personal computers - Laptops and notebooks - Servers and data centers - Networking equipment - Consumer electronics

Detailed and Complete Alternative Models

• AS4C256M16D3LB-12BINTR: 256 Megabit (32 Megabyte) DDR3 SDRAM memory module with similar specifications.
• AS4C1G8D3LA-12BCNTR: 1 Gigabit (128 Megabyte) DDR3 SDRAM memory module with higher capacity.

Note: This entry provides a brief overview of the AS4C512M8D3LB-12BINTR memory module. For more detailed information, please refer to the datasheet provided by the manufacturer.

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