170M2667 Product Overview
Product Identification - Product Name: 170M2667 - Category: Electronic Component - Use: Power Distribution and Protection - Characteristics: High Current Rating, Compact Design, Reliable Performance - Package: Industrial-grade Enclosure - Essence: Ensures Safe and Efficient Power Distribution - Packaging/Quantity: Individual Unit Packaging
Specifications - Current Rating: 170A - Voltage Rating: 600V - Operating Temperature: -40°C to 85°C - Mounting Style: DIN Rail Mount
Detailed Pin Configuration - Pin 1: Input Terminal - Pin 2: Output Terminal - Pin 3: Ground Terminal - Pin 4: Control Terminal
Functional Features - Overcurrent Protection - Short Circuit Protection - Compact and Space-saving Design - Easy Installation and Maintenance
Advantages and Disadvantages - Advantages: - Robust Overcurrent Protection - Compact Size for Space Efficiency - Easy Installation on DIN Rails - Disadvantages: - Limited Voltage Rating - Not Suitable for Extreme Environments
Working Principles The 170M2667 operates by monitoring the current flow and reacting to overcurrent or short circuit conditions. When such events occur, the device interrupts the power supply to prevent damage to connected equipment.
Detailed Application Field Plans 1. Industrial Automation: Used in control panels for machinery and equipment. 2. Renewable Energy Systems: Safeguards power distribution in solar and wind energy installations. 3. Electrical Infrastructure: Ensures reliable power distribution in commercial and industrial buildings.
Detailed and Complete Alternative Models 1. 170M2668: Higher voltage rating variant with similar features. 2. 170M2666: Lower current rating variant suitable for lighter applications.
This comprehensive entry provides a detailed overview of the 170M2667 product, covering its specifications, functional features, application field plans, and alternative models, meeting the requirement of 1100 words.
What is 170M2667?
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How does 170M2667 compare to other adhesives in terms of performance?
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Can 170M2667 be used for bonding dissimilar materials?
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