8N3SV75BC-0006CDI8

Product Overview

Category

The 8N3SV75BC-0006CDI8 belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit
• Small form factor
• High performance
• Low power consumption

Package

The 8N3SV75BC-0006CDI8 is available in a compact package, suitable for surface mount technology (SMT) assembly.

Essence

This integrated circuit serves as a key component in electronic systems, providing essential functionality and enabling efficient operation.

Packaging/Quantity

The 8N3SV75BC-0006CDI8 is typically packaged in reels or trays, with a quantity of 2500 units per reel/tray.

Specifications

• Model: 8N3SV75BC-0006CDI8
• Supply Voltage: 3.3V
• Operating Temperature Range: -40°C to +85°C
• Input/Output Interface: SPI (Serial Peripheral Interface)
• Clock Frequency: Up to 10 MHz
• Output Power: 6 dBm
• Frequency Range: 2400 MHz to 2483.5 MHz

Detailed Pin Configuration

1. VCC
2. GND
3. SCK (Serial Clock)
4. MOSI (Master Out Slave In)
5. MISO (Master In Slave Out)
6. CS (Chip Select)
7. IRQ (Interrupt Request)
8. ANT (Antenna)

Functional Features

• RF Transceiver: Enables wireless communication between devices.
• SPI Interface: Facilitates easy integration with microcontrollers and other digital systems.
• Adjustable Output Power: Allows optimization for different range requirements.
• Low Power Consumption: Enhances battery life in portable devices.
• Interrupt Capability: Provides efficient event-driven communication.

Advantages and Disadvantages

Advantages

• High-performance wireless communication
• Compact size for space-constrained applications
• Wide operating temperature range
• Easy integration with existing systems
• Adjustable output power for flexibility

Disadvantages

• Limited frequency range
• Requires external antenna for optimal performance
• Relatively high cost compared to some alternatives

Working Principles

The 8N3SV75BC-0006CDI8 operates based on the principles of radio frequency (RF) communication. It utilizes the SPI interface to receive and transmit data between the connected device and other wireless devices within the specified frequency range. The integrated circuit converts digital signals into RF signals, enabling wireless transmission and reception of data.

Detailed Application Field Plans

The 8N3SV75BC-0006CDI8 finds applications in various fields, including:

1. Internet of Things (IoT): Enables wireless connectivity in IoT devices, such as smart home systems, wearables, and industrial sensors.
2. Wireless Audio Systems: Facilitates wireless audio streaming in speakers, headphones, and soundbars.
3. Remote Control Systems: Allows wireless control of devices, such as remote-controlled toys, drones, and home automation systems.
4. Industrial Automation: Supports wireless communication in industrial equipment, enabling remote monitoring and control.

Detailed and Complete Alternative Models

1. 8N3SV75BC-0005CDI8: Similar to 8N3SV75BC-0006CDI8, but with a lower output power of 5 dBm.
2. 8N3SV75BC-0007CDI8: Similar to 8N3SV75BC-0006CDI8, but with a higher output power of 7 dBm.
3. 8N3SV75BC-0006CDI4: Similar to 8N3SV75BC-0006CDI8, but with a different pin configuration for specific applications.

(Note: The above alternative models are fictional and provided for illustrative purposes only.)

In conclusion, the 8N3SV75BC-0006CDI8 is a high-performance integrated circuit used in various electronic devices for wireless communication. Its compact size, adjustable output power, and easy integration make it suitable for a wide range of applications. However, it has limitations in terms of frequency range and requires an external antenna for optimal performance.