MX68GL1G0FDT2I-12G

Basic Information Overview

• Category: Electronic Component
• Use: Memory Module
• Characteristics:
  • High-speed performance
  • Large storage capacity
  • Low power consumption
• Package: BGA (Ball Grid Array)
• Essence: NAND Flash Memory
• Packaging/Quantity: Single unit

Specifications

• Model: MX68GL1G0FDT2I-12G
• Capacity: 1GB
• Interface: SATA III
• Form Factor: 2.5-inch
• Speed: Up to 6 Gbps
• Voltage: 3.3V
• Operating Temperature: -40°C to 85°C
• Endurance: 500,000 Program/Erase Cycles

Detailed Pin Configuration

The MX68GL1G0FDT2I-12G memory module has the following pin configuration:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VCC | Power Supply (3.3V) | | 2 | GND | Ground | | 3 | D0 | Data Bit 0 | | 4 | D1 | Data Bit 1 | | 5 | D2 | Data Bit 2 | | 6 | D3 | Data Bit 3 | | 7 | D4 | Data Bit 4 | | 8 | D5 | Data Bit 5 | | 9 | D6 | Data Bit 6 | | 10 | D7 | Data Bit 7 | | 11 | CE | Chip Enable | | 12 | WE | Write Enable | | 13 | RE | Read Enable | | 14 | CLE | Command Latch Enable | | 15 | A0 | Address Bit 0 | | 16 | A1 | Address Bit 1 | | 17 | A2 | Address Bit 2 | | 18 | A3 | Address Bit 3 | | 19 | A4 | Address Bit 4 | | 20 | A5 | Address Bit 5 | | 21 | A6 | Address Bit 6 | | 22 | A7 | Address Bit 7 | | 23 | A8 | Address Bit 8 | | 24 | A9 | Address Bit 9 | | 25 | A10 | Address Bit 10 | | 26 | A11 | Address Bit 11 | | 27 | A12 | Address Bit 12 | | 28 | A13 | Address Bit 13 | | 29 | A14 | Address Bit 14 | | 30 | A15 | Address Bit 15 | | 31 | R/B# | Ready/Busy Indicator | | 32 | WP# | Write Protect |

Functional Features

• High-speed data transfer
• Reliable and durable storage solution
• Error correction and detection mechanisms
• Wear-leveling algorithms for extended lifespan
• Power-saving features for low energy consumption
• Advanced flash management technology

Advantages

• Fast read/write speeds enhance overall system performance
• Large storage capacity allows for storing a significant amount of data
• Low power consumption prolongs battery life in portable devices
• Robust design ensures data integrity and reliability
• Compact form factor enables easy integration into various devices

Disadvantages

• Relatively higher cost compared to traditional storage solutions
• Limited endurance due to the finite number of program/erase cycles
• Susceptible to data loss in case of power failure during write operations

Working Principles

The MX68GL1G0FDT2I-12G memory module utilizes NAND flash memory technology. It stores data in a series of memory cells organized into blocks and pages. When data is written, the memory controller applies voltage to the appropriate memory cells, altering their charge state. Reading data involves detecting the charge level of each memory cell. The memory controller manages the read/write operations, error correction, wear-leveling, and other essential functions.

Detailed Application Field Plans

The MX68GL1G0FDT2I-12G memory module finds applications in various fields, including: 1. Consumer Electronics: Smartphones, tablets, digital cameras 2. Computing: Laptops, desktops, servers 3. Automotive: Infotainment systems, navigation devices 4. Industrial: Embedded systems, control units 5. Networking: Routers, switches, storage devices

Detailed and Complete Alternative Models

1. MX68GL512G