MT29F128G08AUABAC5:B

Product Overview

Category: Flash Memory
Use: Data storage in electronic devices
Characteristics: High capacity, non-volatile, fast read/write speeds
Package: BGA (Ball Grid Array)
Essence: NAND Flash memory chip
Packaging/Quantity: Individual chip

Specifications

• Model: MT29F128G08AUABAC5:B
• Capacity: 128GB
• Interface: Parallel
• Voltage: 3.3V
• Access Time: 25 ns
• Operating Temperature: -40°C to +85°C
• Data Retention: Up to 10 years
• Endurance: Up to 100,000 program/erase cycles

Detailed Pin Configuration

The MT29F128G08AUABAC5:B flash memory chip has the following pin configuration:

1. VCC: Power supply voltage
2. GND: Ground
3. A0-A18: Address inputs
4. DQ0-DQ15: Data input/output
5. WE#: Write enable
6. CE#: Chip enable
7. RE#: Read enable
8. CLE: Command latch enable
9. ALE: Address latch enable
10. R/B#: Ready/busy status output

Functional Features

• High-speed data transfer
• Non-volatile storage
• Low power consumption
• Error correction capability
• Block erase and program operations
• Wear-leveling algorithm for extended lifespan

Advantages and Disadvantages

Advantages: - Large storage capacity - Fast read/write speeds - Reliable data retention - Compact package size - Suitable for various electronic devices

Disadvantages: - Limited endurance compared to other memory types - Higher cost per gigabyte compared to traditional hard drives

Working Principles

The MT29F128G08AUABAC5:B flash memory chip utilizes NAND technology for data storage. It consists of a grid of memory cells, where each cell stores multiple bits of information. The data is stored by trapping electric charges in the floating gate of each memory cell. To read or write data, specific voltage levels are applied to the appropriate pins, enabling the transfer of electrons and altering the charge state of the memory cells.

Detailed Application Field Plans

The MT29F128G08AUABAC5:B flash memory chip finds applications in various electronic devices, including: - Solid-state drives (SSDs) - USB flash drives - Digital cameras - Mobile phones - Tablets - Embedded systems

Detailed and Complete Alternative Models

1. MT29F256G08CJAAA: 256GB capacity, BGA package, parallel interface
2. MT29F512G08CKCBB: 512GB capacity, BGA package, parallel interface
3. MT29F1T08EMHAFJ4: 1TB capacity, BGA package, parallel interface

These alternative models offer higher capacities while maintaining similar characteristics and pin configurations.

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