PA-830-352G-R2
Product Overview
Category: Electronic Component
Use: Signal Amplification
Characteristics: High Gain, Low Noise, Wide Bandwidth
Package: SMD (Surface Mount Device)
Essence: Amplifier for RF (Radio Frequency) Signals
Packaging/Quantity: 100 pieces per reel
Specifications
- Frequency Range: 1MHz - 3GHz
- Gain: 20dB
- Noise Figure: 2.5dB
- Supply Voltage: 3V - 5V
- Current Consumption: 10mA
- Operating Temperature: -40°C to 85°C
Detailed Pin Configuration
- VCC
- RF Input
- Ground
- RF Output
Functional Features
- High gain for weak signal amplification
- Low noise figure for minimal signal distortion
- Wide bandwidth for versatile signal amplification needs
- Small form factor for space-constrained applications
Advantages and Disadvantages
Advantages: - High gain improves signal reception in low-signal environments - Low noise figure preserves signal integrity - Wide bandwidth allows for diverse signal amplification needs
Disadvantages: - Requires careful PCB layout for optimal performance - Sensitive to voltage fluctuations
Working Principles
PA-830-352G-R2 operates by receiving an RF input signal and amplifying it with high gain while maintaining low noise. The amplified signal is then output through the RF output pin.
Detailed Application Field Plans
- Wireless Communication Devices: Enhance signal reception in mobile phones, Wi-Fi routers, and Bluetooth devices.
- RF Testing Equipment: Boost weak signals for accurate testing and measurement.
- Satellite Communication Systems: Amplify satellite signals for improved reception in communication systems.
Detailed and Complete Alternative Models
- PA-830-351G-R2: Similar specifications with a different package type.
- PA-830-353G-R2: Higher gain and wider bandwidth for more demanding applications.
This comprehensive entry provides a detailed understanding of PA-830-352G-R2, its specifications, features, and application scenarios, catering to professionals and enthusiasts in the electronics industry.
Luettele 10 yleistä kysymystä ja vastausta, jotka liittyvät PA-830-352G-R2 :n soveltamiseen teknisissä ratkaisuissa
What is PA-830-352G-R2?
- PA-830-352G-R2 is a high-performance, multi-purpose adhesive commonly used in technical solutions for bonding various materials.
What materials can PA-830-352G-R2 bond?
- PA-830-352G-R2 can bond a wide range of materials including metals, plastics, composites, and ceramics.
What is the temperature resistance of PA-830-352G-R2?
- PA-830-352G-R2 has excellent temperature resistance, withstanding both high and low temperatures, making it suitable for diverse applications.
Is PA-830-352G-R2 suitable for outdoor use?
- Yes, PA-830-352G-R2 is designed to withstand outdoor conditions, making it suitable for outdoor applications.
Does PA-830-352G-R2 require special surface preparation before application?
- Yes, for optimal bonding, surfaces should be clean, dry, and free from contaminants before applying PA-830-352G-R2.
What is the curing time of PA-830-352G-R2?
- The curing time of PA-830-352G-R2 varies depending on factors such as temperature and humidity, but typically ranges from a few minutes to several hours.
Can PA-830-352G-R2 be used for structural bonding?
- Yes, PA-830-352G-R2 is suitable for structural bonding applications, providing strong and durable bonds.
Is PA-830-352G-R2 resistant to chemicals and solvents?
- Yes, PA-830-352G-R2 exhibits good resistance to a wide range of chemicals and solvents, enhancing its suitability for various environments.
Can PA-830-352G-R2 be used in electronic applications?
- Yes, PA-830-352G-R2 is compatible with electronic applications and offers reliable bonding for electronic components.
Is PA-830-352G-R2 compliant with industry standards and regulations?
- Yes, PA-830-352G-R2 complies with industry standards and regulations, ensuring its reliability and safety in technical solutions.