XC6SLX75-3FGG676C

Product Overview

Category

XC6SLX75-3FGG676C belongs to the category of Field Programmable Gate Arrays (FPGAs).

Use

This product is commonly used in digital circuit design and implementation. FPGAs provide a flexible and customizable solution for various applications, including telecommunications, automotive, aerospace, and consumer electronics.

Characteristics

• High-performance: The XC6SLX75-3FGG676C offers high-speed processing capabilities, making it suitable for demanding applications.
• Programmability: FPGAs can be reprogrammed multiple times, allowing for easy modifications and updates to the design.
• Versatility: This FPGA supports a wide range of functions and features, making it adaptable to different project requirements.

Package

The XC6SLX75-3FGG676C comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of this product lies in its ability to provide a programmable hardware platform that enables users to implement complex digital circuits efficiently.

Packaging/Quantity

The XC6SLX75-3FGG676C is typically sold individually or in reels, with each reel containing a specific quantity of units. The exact packaging and quantity may vary depending on the supplier.

Specifications

• Logic Cells: 75,000
• Flip-Flops: 37,500
• Block RAM: 2,160 Kbits
• DSP Slices: 240
• Maximum Frequency: 550 MHz
• Operating Voltage: 1.2V
• I/O Standards: LVCMOS, LVTTL, HSTL, SSTL, LVDS, RSDS, Mini-LVDS, etc.
• Operating Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The XC6SLX75-3FGG676C has a total of 676 pins, each serving a specific purpose in the circuit design. The pin configuration includes input/output pins, power supply pins, clock pins, and configuration pins. For a detailed pinout diagram and description, refer to the product datasheet.

Functional Features

High-Speed Processing

The XC6SLX75-3FGG676C offers high-speed processing capabilities, allowing for efficient execution of complex algorithms and real-time data processing.

Reconfigurability

Being an FPGA, this product provides the advantage of reconfigurability. Users can modify the hardware design by reprogramming the FPGA, eliminating the need for physical changes or redesigns.

Integration

The XC6SLX75-3FGG676C integrates various components such as logic cells, flip-flops, block RAM, and DSP slices, providing a comprehensive solution for digital circuit implementation.

Design Flexibility

FPGAs offer design flexibility, enabling users to implement custom logic functions and interfaces tailored to their specific application requirements.

Advantages and Disadvantages

Advantages

• High-performance processing capabilities
• Reconfigurable nature allows for easy updates and modifications
• Versatile functionality suitable for diverse applications
• Design flexibility enables customization

Disadvantages

• Higher cost compared to fixed-function integrated circuits
• Steeper learning curve for programming and utilizing FPGAs effectively
• Increased power consumption compared to dedicated hardware solutions

Working Principles

The XC6SLX75-3FGG676C operates based on the principles of configurable logic blocks (CLBs) and interconnect resources. CLBs consist of look-up tables (LUTs), flip-flops, and multiplexers, which can be programmed to implement desired logic functions. Interconnect resources provide connectivity between different CLBs, allowing for the flow of data and control signals.

Detailed Application Field Plans

The XC6SLX75-3FGG676C finds applications in various fields, including:

1. Telecommunications: Used in base stations, network routers, and switches for high-speed data processing and protocol handling.
2. Automotive: Employed in advanced driver-assistance systems (ADAS) for real-time image processing, sensor fusion, and control algorithms.
3. Aerospace: Utilized in satellite communication systems, radar signal processing, and flight control systems.
4. Consumer Electronics: Integrated into high-definition televisions, gaming consoles, and multimedia devices for enhanced performance and functionality.

Detailed and Complete Alternative Models

1. XC6SLX100-3FGG676C: Offers higher logic capacity and additional features compared to XC6SLX75-3FGG676C.
2. XC6SLX25-3FGG676C: Provides a lower-cost alternative with reduced logic capacity but suitable for less demanding applications.
3. XC6SLX150-3FGG676C: Offers increased logic capacity and enhanced performance for complex designs requiring higher computational capabilities.

These alternative models