Samtec Inc.
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QMSS-064-06.75-H-D-DP-GP

QMSS-064-06.75-H-D-DP-GP

.635MM DOUBLE ROW SHIELDED TERMI
Osa numero
QMSS-064-06.75-H-D-DP-GP
Valmistaja/merkki
Samtec Inc.
Sarja
Q2™ QMSS
Osan tila
Active
Asennustyyppi
Surface Mount
ominaisuudet
Board Guide, Ground Bus (Plane), Shielded
Korkeus laudan yläpuolella
0.265" (6.73mm)
Liittimen tyyppi
Differential Pair Array, Male
Asemien lukumäärä
128
Rivien määrä
2
Ota yhteyttä Finish
Gold
Yhteystiedot Pinta paksuus
30.0µin (0.76µm)
Piki
0.025" (0.64mm)
Paritetut pinoamiskorkeudet
11mm
Pyydä tarjous
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Varastossa 18686 PCS
Yhteystiedot
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Avainsanat aiheesta QMSS-064-06.75-H-D-DP-GP
QMSS-064-06.75-H-D-DP-GP Elektroniset komponentit
QMSS-064-06.75-H-D-DP-GP Myynti
QMSS-064-06.75-H-D-DP-GP Toimittaja
QMSS-064-06.75-H-D-DP-GP Jakelija
QMSS-064-06.75-H-D-DP-GP Tietotaulukko
QMSS-064-06.75-H-D-DP-GP Kuvat
QMSS-064-06.75-H-D-DP-GP Hinta
QMSS-064-06.75-H-D-DP-GP Tarjous
QMSS-064-06.75-H-D-DP-GP Alin hinta
QMSS-064-06.75-H-D-DP-GP Hae
QMSS-064-06.75-H-D-DP-GP Ostaminen
QMSS-064-06.75-H-D-DP-GP Chip